无线集成电路与系统实验室（WiCAS）
Wireless Integrated Circuit and System Lab
MS/PhD/Postdoc positions open！
现招收品学兼优、勇于创新的硕士生、博士生以及博士后。
欢迎有志于从事射频／模拟／数字IC设计、天线、智能系统及算法研究的同学加入。
实验室为学生提供与工业界接轨的设计理念，开放包容的科研环境和帮助优秀学生提供工业界实习机会。
WiCAS课题组研究方向：
先进CMOS工艺上的高性能收发机架构与芯片设计
应用于智能传感器和5G/6G通讯的毫米波集成电路与系统
面向智能物联网和可穿戴等新型应用的无线SoC芯片与算法一体化微系统
教育背景
美国加州大学圣芭芭拉分校，电子与计算机工程，博士
美国加州大学圣芭芭拉分校，经济学，硕士
上海复旦大学，电子工程，学士
工作经历：
2015年-至今合乐HL8注册登录，研究员，博士生导师
2005年-2015年英特尔公司 (Intel Corp) ，英特尔研究院（Intel Labs）主管研究科学家
主要成果及荣誉
IEEE 高级会员
已发表在包含行业顶级期刊ISSCC和JSSC在内的100+篇论文：
无线集成电路：9 ISSCC; 9 JSSC; 1 TCASI; 2 RFIC; 1 CICC; 3 VLSI-C; 2 ESSCIRC
微波集成电路：2 TMTT; 8 MWCL; 4 IMS; 2 CSICS
器件与工艺：2 EDL; 1 VLSI-T; 1 DRC
天线与算法：1 TAP; 3 ACCESS
13项美国专利
2篇英文著作
近期国际学术重要职务
IEEE 国际固态电路会议 ISSCC 技术评审委员
IEEE 国际射频集成电路会议 RFIC 指导委员/技术评审委员
IEEE MWCL 副主编 2019至今
IEEE 国际电子器件会议 IEDM 技术评审委员 2021-2022
IEEE 国际无线会议 IWS 技术评审委员 2013-2020
IEEE JSSC 特邀编辑 Guest Editor 2019-2020
行业研发经历
1.高集成度智能毫米波传感器SoC
·集成毫米波收发机、超宽带调频锁相环、高精度ADC、信号处理加速器、电源管理等关键功能的单芯片智能毫米波传感器SoC。广泛应用于自动驾驶、无人机、机器人、智能家居等多样化智能物联网领域。
2.超低功耗SoC系统开发项目
·业界首枚14纳米CMOS无线低功耗WiFi SoC芯片，应用于搭建无线传感网、物联网和可穿戴设备。
3.先进CMOS工艺下高性能无线收发机的设计
·超过15年包括收发机前端的无线射频元件，无线系统开发及射频电路数字化创新。经历从90纳米到14纳米的无线系统开发，开发出用于低功耗和低成本无线系统的颠覆性的无线收发机的架构，并应用于英特尔无线通讯产品中。
4.高性能CMOS数字射频功率放大器（PA）
·领导并研发了多款高性能CMOS功率放大器。其中首创的outphasing和dynamic power control数字式功率放大器，成果证明了用数字方法实现射频的射频功率放大器，性能可以超越传统的设计方式，成为行业性能标杆。
5.全集成基于高性能GaN HEMT的微波电路（MMIC）
·净化间微波GaN HEMT器件工艺开发，完成从微波器件制造，工艺集成到电路建模和设计流程，设计开发包括PA，VCO和LNA在内的高性能微波电路。
·首创了可集成在化合物半导体上的可调制铁电材料器件制造工艺，极大减小微波元件的尺寸，并设计高性能自适应的微波电路。
近期论文／报告选摘
1. K. Xu, B. Yu, J. Hu, Y. Li, R. B. Staszewski, and Hongtao Xu, “A 50μW Ring-Type Complementary Inverse-Class-D Oscillator with 191.4dBc/Hz FoM and 205.6dBc/Hz FoMA”, 2023 Symposium on VLSI Circuits (VLSI-C), 2023, June 11-16
2. C. Hu, D. Zheng, Y. Yin, J. Lin, Y. Li, W. Li, and Hongtao Xu, “A 0.7-to-2.5GHz Sliding Digital-IF Quadrature Digital Transmitter Achieving >40% System Efficiency for Multi-Mode NB-IoT/BLE Applications,” IEEE International Solid-State Circuits Conference (ISSCC), 2023, 472-473
3. J. Li, Y. Yin, H. Chen, J. Lin, Y. Li, X. Jia, Z. Hu, X. Zhang, and Hongtao Xu, “A 4.1W Quadrature Doherty Digital Power Amplifier with 33.6% Peak PAE in 28nm Bulk CMOS,” IEEE International Solid-State Circuits Conference (ISSCC), 2023, 370-371
4. W. Zeng, L. Gao, N. Sun, Hongtao Xu, Q. Xue, X. Zhang, “A 19.7-to-43.8GHz Power Amplifier with Broadband Linearization Technique in 28nm Bulk CMOS,” IEEE International Solid-State Circuits Conference (ISSCC), 2023 372-373
5. C. Wang, W. Li, F. Chen, W. Zuo, Y. Pu, and Hongtao Xu, “A 0.5–4GHz Full-Duplex Receiver with Multi-Domain Self-Interference Cancellation Using Capacitor Stacking Based Second-Order Delay Cells in RF Canceller”, 2022 IEEE Radio Frequency Integrated Circuits Symposium (RFIC), 2022, June 19-21
6. C. Hu, Y. Yin, T. Li, Y. Liu, L. Xiong, and Hongtao Xu, “A Fully-Integrated Wideband Digital Polar Transmitter with 11-bit Digital-to-Phase Converter in 40nm CMOS”, IEEE Journal of Solid-State Circuits (JSSC), 2023, 58(2), 462-473
7. C-C. Yang , T. Li, C. Xu, Y. Chen, Y. Lin , Y. Yin, and Hongtao Xu, A Low-Phase Error Cascode CMOS Variable Gain Amplifier With 180◦ Phase Control for Phase Array Systems, IEEE Transactions on Microwave Theory and Techniques (TMTT), 2022
8. T-Q Fan, B. Jiang, R. Liu, J. Xiu, Y. Lin, and H. Xu, “A Novel Double U-slot Microstrip Patch Antenna Design for Low-Profile and Broad Bandwidth Applications”, IEEE Transactions on Antennas and Propagation (TAP), 2022
9. Y. Li, Y. Yin, D. Zheng, X. Jia, J. Lin, F. Gao, Y. Zhu, L. Xiong, N. Yan, Y. Lu, and Hongtao Xu, “A 15-bit Quadrature Digital Power Amplifier with Transformer-Based Complex Domain Efficiency Enhancement”, IEEE Journal of Solid-State Circuits (JSSC), 2021
10. X. Luo, H. J. Qian, Y. Yin, Hongtao Xu, “Empowering Multifunction: Digital Power Amplifiers, the Last RF Frontier of the Analog and Digital Kingdoms”, IEEE Microwave Magazine, 2020
11. Y. Yin, L. Xiong, Y. Zhu, B. Chen, H. Min, and Hongtao Xu, “A Broadband Switched-Transformer Digital Power Amplifier for Deep Back-Off Efficiency Enhancement”, IEEE Journal of Solid-State Circuits (JSSC), 2020
12. D. Zheng, Y. Yin, Y. Zhu, L. Xiong, Y. Li, N. Yan, and Hongtao Xu, “A 15b Quadrature Digital Power Amplifier with Transformer-Based Complex-Domain Power-Efficiency Enhancement”, 2020 IEEE International Solid-State Circuits Conference (ISSCC), 2020
13. T. Li, L Xiong, Y. Yin, Y. Liu, H. Min, N. Yan, and Hongtao Xu, “A Wideband Digital Polar Transmitter with Integrated Capacitor-DAC-Based Constant-Envelope Digital-to-Phase Converter”, 2019 IEEE Radio Frequency Integrated Circuits Symposium (RFIC), 2019
14. Y. Yin, L. Xiong, Y. Zhu, B. Chen, H. Min, and Hongtao Xu, “A Compact Dual-Band Digital Polar Doherty Power Amplifier Using Parallel-Combining Transformer”, IEEE Journal of Solid-State Circuits (JSSC), 2019
15. W. Luo, Y. Yin, L. Xiong, T. Li, and Hongtao Xu, “Nonlinear Analytical Model for Switched-Capacitor Class-D RF Power Amplifiers”, IEEE Transactions on Circuits and Systems I: Regular Papers (TCAS-I), 2019
16. Y. Yin, Y. Zhu, L. Xiong, W. Luo, B. Chen, T. Li, N. Yan, and Hongtao Xu, “A Compact Transformer-Combined Polar/Quadrature Reconfigurable Digital Power Amplifier in 28nm Logic LP CMOS”, IEEE Journal of Solid-State Circuits (JSSC invited), 2019
17. L. Xiong, T. Li, Y. Yin, H. Min, N. Yan, and Hongtao Xu, “A Broadband Switched-Transformer Digital Power Amplifier for Deep Back-Off Efficiency Enhancement”, 2019 IEEE International Solid-State Circuits Conference (ISSCC), 2019
18. Y. Zhu, L. Xiong, Y. Yin, W. Luo, B. Chen, T. Li, Hongtao Xu, “A Compact 2.4GHz Polar/Quadrature Reconfigurable Digital Power Amplifier in 28nm Logic LP CMOS”, 2018 IEEE Custom Integrated Circuits Conference (CICC), 2018 (Best Student Paper final list).
19. Y. Yin, L. Xiong, Y. Zhu, B. Chen, H. Min, Hongtao Xu, “A Compact Dual-Band Digital Doherty Power Amplifier Using Parallel- Combining Transformer for Cellular NB-IoT Applications”, 2018 IEEE International Solid-State Circuits Conference (ISSCC), 2018
20. P. Madoglio, Hongtao Xu, K. Chandrashekar et al., “A 2.4GHz WLAN Digital Polar Transmitter with Synthesized Digital-to-Time Converter in 14nm Trigate/FinFET Technology for IoT and Wearable Applications”, 2017 IEEE International Solid-State Circuits Conference (ISSCC), 2017
21. A. Ravi, P. Madoglio, Hongtao Xu et al., “A 2.4-GHz 20–40-MHz Channel WLAN Digital Outphasing Transmitter Utilizing a Delay-Based Wideband Phase Modulator in 32-nm CMOS”, IEEE Journal of Solid-State Circuits (JSSC), 2012
22. W. Tai, Hongtao Xu, Ravi, A. et al., “A Transformer-Combined 31.5 dBm Outphasing Power Amplifier in 45 nm LP CMOS With Dynamic Power Control for Back-Off Power Efficiency Enhancement”, IEEE Journal of Solid-State Circuits (JSSC), 2012
23. P. Madoglio, A. Ravi, Hongtao Xu et al., “A 20dBm 2.4GHz digital outphasing transmitter for WLAN application in 32nm CMOS”, 2012 IEEE International Solid-State Circuits Conference (ISSCC), 2012
24. W. Tai, Hongtao Xu, A. Ravi et al., “A 31.5dBm Outphasing Class-D Power Amplifier in 45nm CMOS with Back-Off Efficiency Enhancement by Dynamic Power Control”. 2011 European Solid-State Circuits Conference (ESSCIRC), 2011
25. Hongtao Xu, Y. Palaskas, A. Ravi et al., “A Flip-Chip-Packaged 25.3 dBm Class-D Outphasing Power Amplifier in 32 nm CMOS for WLAN Application”, IEEE Journal of Solid-State Circuits (JSSC invited), 46(7), 2011
26. Y. Tan, Hongtao Xu, M.A. El-tanani et al., “A flip-chip-packaged 1.8V 28dBm class-AB power amplifier with shielded concentric transformers in 32nm SoC CMOS”, 2011 IEEE International Solid-State Circuits Conference (ISSCC), 2011
27. Hongtao Xu, Y. Palaskas, A. Ravi et al., A highly linear 25dBm outphasing power amplifier in 32nm CMOS for WLAN application”, 2010 European Solid-State Circuits Conference (ESSCIRC), 2010
28. Hongtao Xu, Y. Palaskas, A. Ravi et al., A 28.1dBm class-D outphasing power amplifier in 45nm LP digital CMOS, 2009 Symposium on VLSI Circuits (VLSI-C), 2009
